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Single pulsed laser was used to shock the local surface of a film, the thermal stress, thermal strain and stress relaxation produced in the heated area, cooling and heating connection, as well as the bond interface of the film-substrate interface were theoretically analyzed and the thermodynamic response of creep deformation mechanisms and non-elastic deformation were studied. The results indicate that the film will produce stress relaxation under high temperature and cooling annealing, a tensile stress will also be produced by cooling annealing, the film crack is caused by the oversize of tensile stress, the creep characteristics of film is one of the film fracture thermodynamic response, which is lied in the property and size of stress, and the evaluation of film property will be accomplished by using the method of laser thermal stress.